Specialised Technical Seminar

08: 45 – 09:00

Registration

09:00 – 09:40

Prof. CUI Guo Feng

Electronic Packaging Gold Tin Electroplating and Development of Electroplating Testing Instrument Research

Dr. Jiang Jianping (Nantong Xingshengyi New Materials Technology Co., Ltd.)

Opportunities of ENIG/ENEPIG Technology in Advanced  Electronics Manufacturing

10:20 – 10:35

Break

10:35 – 11:15

Dr. Xiao Ning (Beijing University of Chemical Technology)

Synthesis And Performance Research Of Copper Plating Additives Used For PCB Microvia Filling

11:15 – 11:55

Prof. FU Xian Zhu (Shenzhen University)

Electroless Deposition Technology for Electrical Interconnections

11:55 – 13:20

Lunch Time

13:20 – 14:00

Prof. Yuttanant Boonyongmaneerat (Chulalongkorn University Thailand)

Collaborative Research to Advance Nickel-Based Electrodeposition for High-Erosion and High-Temperature Applications

14:00 – 14:40

Prof. Jonathan Chung (City University of Hong Kong)

Good Practices In Mechanical Polishing Before More Precise Surface Finishing And Advanced Coating For Automotive And Watches Industries.

14:40 – 15:20

Mr. David Shi (Tian Jin AL-ONE Tech. Dev. Co., Ltd.)

The Development and Frontier of Aluminium Surface Treatment

15:20 – 15:35

Break

15:35 – 16:15

Mr. Zhao Yongqiang (Shenzhen Sanshun Fine Chemical Industry Co., Ltd.)

All-Solution-Processed Metallization of Through Glass Vias (TGVs) with a High Adhesion Promoting Layer (APL)

16:15 – 16:55

Mr. Feng Xiaolong (Kangqiang Electronics)

Roll-to-Roll Continuous High-Precision Selective Photoresist Electroplating and Highly Reliable Brown Oxidation Technology

16:55 – 17:30

Closing Remarks